ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17 ECCOBOND 2332-17
ECCOBOND 2332-17 is a solventless epoxy adhesive that
develops high bond strength when cured at temperatures as
low as 100 to 130°C. It combines flexibility at low temperatures
plus high peel and tensile shear strength over a broad
temperature range.
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