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SI 5404™ is designed to bond metallic heat sinks, ceramic
chips and circuit board substrates. SI 5404™ applications
include the bonding of various heat generating devices (power
devices) to their respective heat sinks. The adhesive is
designed to provide a strong bond between the device and its
heat sink as well as low resistance to the flow of heat from the
electronic device to the heat sink. A typical application would
be the bonding of any power semiconductor, module, graphics
processor or other heat generating device to a heat sink or
metal enclosure in an electronics circuit.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 2.3 to 2.45LMS
VOC, ASTM D 3960, g/l 32.1
Flash Point - See SDS
Extrusion Rate, g/min:
Pressure 0.35 MPa, temperature 25 °C:
Semco Cartridge 180 to 400LMS
TYPICAL CURING PERFORMANCE
We recommend minimizing the time during which the fixtured parts
are exposed to a temperature above 30°C. This will help maintain a
consistent dispersion of the conductive filler within the adhesive
matrix.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or
greater than 8 °C can adversely affect product properties.
SI 5404™设计用于粘接金属散热器，陶瓷
芯片和电路板基板。 SI 5404™应用
包括各种发热装置的接合（动力
设备）到它们各自的散热器。粘合剂是
旨在提供设备与其之间的牢固联系
散热片以及耐 |
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