ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
乐泰 ABLESTIK G 500HF is a general purpose epoxy adhesiveand sealant that cures to a high gloss finish.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Density, g/cm3 1.45
Sag Resistance, mils 600 to 900
Press Flow, seconds 30 to 60
Shelf Life @ 25°C, months 3
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
60 minutes @ 125°C or
20 minutes @ 150°C or
5 minutes @ 175°C
For optimum performance, follow the initial cure with a post cure of 2 to4 hours at the highest expected use temperature.The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
StorageStore product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: 25°C. Storage greater than or below 25°C can adversely affect product properties. 乐泰 ABLESTIK G 500HF是一种通用环氧胶粘剂和密封剂，固化成高光泽度。
固化材料的典型特性
密度，g / cm 3 1.45
流挂电阻，密耳600至900
按流，秒30至60
保质期@ 25°C，月3
闪点 - 见SDS
典型的固化性能
治愈时间表
在125°C或60分钟
在150°C或20分钟
175分钟5分钟
为了获得*佳性能，请用2次后固化的初始固化在*高预期使用温度下4小时。以上治疗方案是指导性建议。治愈条件（时间和温度）可能会根据客户的经验及其应用要求，以及客户固化设备，烤箱加载和实际烤箱温 |
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